Biochip Package Structure
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United States of America Patent
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Issued Date -
Apr 22, 2010
app pub date -
Dec 17, 2008
filing date -
Oct 20, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A biochip package structure is provided. The biochip package structure includes a substrate, a biochip, at least one wire, and a molding compound. The substrate has a circuit unit electrically connected, by wiring, to the biochip defined with a sensing region. The molding compound covers the wire but leaves the sensing region of the biochip exposed, allowing a cavity to be formed in the sensing region. The cavity delivers a biomedical sample. The biomedical sample reacts in the sensing region. Thus, the biochip package structure is applicable to various medical and biochemical assays.
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