METHOD AND APPARATUS FOR DETERMINING SHEAR FORCE BETWEEN THE WAFER HEAD AND POLISHING PAD IN CHEMICAL MECHANICAL POLISHING
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United States of America Patent
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Issued Date -
Apr 22, 2010
app pub date -
Oct 20, 2008
filing date -
Oct 20, 2008
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Abandoned
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Abstract
A method for (a) determining the shear force between a wafer head and a polishing pad in a polishing tool using a CMP polishing tool with a plate above the wafer head which hangs or rests on the plate. The plate is connected to the CMP polishing tool by (b) low friction motion means (c). A load cell sensor is fixed to the framework of the polishing tool or another immovable structure. (d) The load cell determines the force from the leading edge of the plate when the wafer head is in contact with the polishing pad. (e) Signals from the load cell sensor reporting the shear force. A CMP polishing tool which includes elements corresponding to each of points (a)-(e) in the above method.
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