Positive photosensitive resin composition
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United States of America Patent
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Jun 12, 2012
Grant Date -
Apr 22, 2010
app pub date -
Oct 20, 2009
filing date -
Oct 20, 2008
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Abstract
Disclosed is a positive photosensitive resin composition that includes (A) a first polybenzoxazole precursor that includes: a repeating unit of Chemical Formula 1 and a thermally polymerizable functional group at at least one terminal end; (B) a second polybenzoxazole precursor that includes a repeating unit of Chemical Formula 3; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent.
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