SUPPORT FOR A SEMICONDUCTOR WAFER IN A HIGH TEMPERATURE ENVIRONMENT
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United States of America Patent
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Issued Date -
Apr 22, 2010
app pub date -
Oct 17, 2008
filing date -
Oct 17, 2008
priority date (Note) -
Abandoned
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Abstract
A wafer support for supporting a semiconductor wafer during a process including varied temperature. The wafer support includes a body having a top surface adapted to receive the semiconductor wafer so a portion of the top surface supports the wafer. The top surface has a recessed area including an inclined surface rising from a bottom of the recessed area. The inclined surface has an incline angle that is no more than about ten degrees.
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