Packaging substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Apr 22, 2010
app pub date -
Oct 21, 2008
filing date -
Oct 21, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A packaging substrate is disclosed, which comprises: a substrate body, wherein a surface thereof has a plurality of conductive pads and a solder mask disposed on the surface and having a plurality of openings to expose the conductive pads; dielectric rings disposed on the inner walls of the openings and extending to parts of the surface of the solder mask surrounding the openings; and metal bumps disposed in the openings and on the conductive pads exposed thereby, and combined with the dielectric rings.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully