MICROELECTROMECHANICAL SYSTEM MICROPHONE PACKAGE
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United States of America Patent
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Issued Date -
Apr 22, 2010
app pub date -
Nov 24, 2008
filing date -
Oct 16, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An MEMS microphone package includes a substrate, a cover, a plurality of conductive members, and an insulative adhesive. The cover is mounted to the substrate. The conductive members are disposed between the substrate and the cover. Each of the conductive members can be a golden wire, a conductive bump, or a conductive metal. Upper ends of the conductive members are connected with the cover and the lower ends of the conductive members are connected with the substrate to enable a conductive loop. The insulative adhesive encapsulates the conductive members. In this way, the substrate, the conductive members, and the cover jointly construct a shielding against EMI.
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