COOLING BODY
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United States of America Patent
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Issued Date -
Apr 15, 2010
app pub date -
Apr 23, 2008
filing date -
Apr 27, 2007
priority date (Note) -
Abandoned
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Abstract
The invention relates to a cooling body for power electronic modules or for semiconductor elements having a flat metal heat dissipation plate, wherein the heat dissipation plate on the side facing the power electronic module or the semiconductor element comprises a surface structured in the manner of a matrix and having protruding elevations, wherein the heat dissipation plate and surface structured in the manner of a matrix are made out of one piece.
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