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United States of America Patent
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N/A
Issued Date -
Apr 15, 2010
app pub date -
Jan 22, 2008
filing date -
Feb 28, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A package is configured by stacking a flat board whereupon a rectangular hole for storing a sensor chip is formed, a flat board whereupon a hole section to be a package inner channel for introducing a measurement target gas into the sensor chip is formed, and a flat board whereupon hole sections which communicate with the package inner channel as an inlet and an outlet of the measurement target gas on the same end surface of the package are formed.
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