Yield evaluating apparatus and method thereof
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United States of America Patent
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Nov 1, 2011
Grant Date -
Apr 8, 2010
app pub date -
Nov 3, 2008
filing date -
Oct 3, 2008
priority date (Note) -
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Abstract
A yield evaluating apparatus and a method thereof are provided. The yield evaluating apparatus includes a spatial correlation module. The spatial correlation module receives at least one process-related data and a plurality of circuit layouts and obtains a correlation coefficient between unit elements in the circuit layouts according to the process-related data. The spatial correlation module calculates a spatial correlation between elements in each of the circuit layouts according to the correlation coefficient and selects one of the circuit layouts according to the spatial correlations.
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