SILICON-BASED MICROPHONE PACKAGE
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United States of America Patent
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Issued Date -
Apr 8, 2010
app pub date -
Oct 2, 2008
filing date -
Oct 2, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A microphone package includes a carrier, a cap, a first silicon-based microphone, and a first integrated circuit chip. The carrier has a first storage space. The cap has a planar part contacting the carrier and a plurality of flanges extending from the planar part and surrounding the carrier. The first silicon-based microphone is disposed in the first storage space and covered by the cap. The first integrated circuit chip is disposed in the first storage space, electrically connected to the first silicon-based microphone, and covered by the cap.
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