Process for adjusting the size and shape of nanostructures
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United States of America Patent
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Apr 24, 2012
Grant Date -
Apr 1, 2010
app pub date -
May 4, 2009
filing date -
May 27, 2005
priority date (Note) -
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Abstract
In accordance with the invention, a lateral dimension of a microscale device on a substrate is reduced or adjusted by the steps of providing the device with a soft or softened exposed surface; placing a guiding plate adjacent the soft or softened exposed surface; and pressing the guiding plate onto the exposed surface. Under pressure, the soft material flows laterally between the guiding plate and the substrate. Such pressure induced flow can reduce the lateral dimension of line spacing or the size of holes and increase the size of mesas. The same process also can repair defects such as line edge roughness and sloped sidewalls. This process will be referred to herein as pressed self-perfection by liquefaction or P-SPEL.
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