METHOD FOR FABRICATING CONDUCTIVE PATTERN
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United States of America Patent
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Issued Date -
Apr 1, 2010
app pub date -
Sep 30, 2008
filing date -
Sep 30, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for fabricating a conductive pattern including following steps is provided. A first conductive layer is formed on a substrate. A patterned hard mask layer is formed on the first conductive layer. A portion of the first conductive layer is removed to expose a portion of the substrate by using the patterned hard mask layer as a mask. A dielectric layer covering the patterned hard mask layer is formed on the substrate. A portion of the dielectric layer is removed to expose the patterned hard mask layer. The patterned hard mask layer is removed to form an opening in the dielectric layer. A second conductive layer is formed in the opening.
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