Integrated Circuit Assemblies and Methods for Encapsulating a Semiconductor Device
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United States of America Patent
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Issued Date -
Apr 1, 2010
app pub date -
Sep 30, 2008
filing date -
Sep 30, 2008
priority date (Note) -
Abandoned
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Abstract
A seal is formed by compressing a cured layer of a composition applied on a substrate. The composition is any liquid, liquefiable, or mastic, which, after application to a surface, is converted or cured to a compressible solid film. The composition includes a flexible polymer as a binding material. The layer on the substrate eliminates the need for a gasket on a contact surface of a mold. The contact surface of the mold compresses the layer during an encapsulation process. The layer remains on the substrate in a finished product. A minimum separation or wall thickness of the mold is defined by the material properties of the mold. The seal eliminates yield loss due to leakage of an encapsulant and reduces maintenance costs associated with the procurement and repeated installation of gaskets on mold tooling.
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