SURFACE MOUNT CONTACT
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United States of America Patent
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N/A
Issued Date -
Mar 18, 2010
app pub date -
Sep 14, 2009
filing date -
Sep 16, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A surface mount contact interposes between a mounted conductor and a pressing conductive member to make the mounted conductor conductive to the pressing conductive member when the mounted conductor and the pressing conductive member are proximate to each other. The surface mount contact includes: a base portion solderable to the mounted conductor; a movable portion elastically deformable according to a distance between the mounted conductor and the pressing conductive member, at least a part of the movable portion being closer to the base portion when the movable portion elastically deforms; and an insulating coating film provided in a region where the movable portion is closer to the base portion and inhibiting electric contact between the movable portion and the base portion.
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