METHOD OF COMPRESSION-MOLDING LIGHT-EMITTING ELEMENTS
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United States of America Patent
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Issued Date -
Mar 18, 2010
app pub date -
Feb 13, 2008
filing date -
Feb 27, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of compression-molding light emitting elements is provided, which can efficiently prevent the formation of a resin burr on a frame on which LED chips (light-emitting elements) are mounted. A tape for resin burr prevention is adhered to a surface of the frame, i.e. the surface on which no light-emitting element is mounted, to form a tape-applied frame. The tape-applied frame is supplied and set onto a setting section of an upper die, with the LED chips directed downwards. A required amount of transparent liquid resin material is dripped by a dispenser into a large cavity including small cavities. Then, both the upper and lower dies are clamped with a required clamping pressure, whereby the LED chips are individually immersed in the resin contained in the small cavities inside the large cavity and compression-molded to form a molded frame (light emitters).
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