SILVER ALLOY SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME
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United States of America Patent
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app pub date -
Nov 24, 2009
filing date -
Jun 24, 2002
priority date (Note) -
Abandoned
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Abstract
A silver alloy sputtering target is provided which is useful in forming a thin silver-alloy film of a uniform thickness by the sputtering method. When crystal orientation strengths are determined at four arbitrary positions by the X-ray diffraction method, the orientation which exhibits the highest crystal orientation strength (X.sub.a) is the same at the four measurement positions, and variations in strength ratio (X.sub.b/X.sub.a) between the highest crystal orientation strength (X.sub.a) and the second highest crystal orientation strength (X.sub.b) is 20% ore less.
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Cited Art Landscape
Patent Citation Ranking
- 6 Citation Count
- C23C Class
- 4.26 % this patent is cited more than
- 15 Age