HIGH PERFORMANCE POLYASPARTIMIDE RESIN
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United States of America Patent
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Issued Date -
Mar 11, 2010
app pub date -
Sep 9, 2008
filing date -
Sep 9, 2008
priority date (Note) -
Abandoned
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Abstract
New polyaspartimide compositions and methods of forming and using those compositions arc provided. The compositions are formed by reacting a bismaleimide and diamine in a solvent-free environment. The resulting polyaspartimide comprising recurring monomers ofThe compositions have properties desirable for use as shape memory polymers as well as in composite products that are useful for building components present in airplanes.
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