DIE MANUFACTURING METHOD, FUNCTIONAL FILM MANUFACTURING METHOD AND FUNCTIONAL FILM

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United States of America Patent

SERIAL NO

12552473

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed herein is a die manufacturing method including the steps of: forming a pattern on the machining surface of a cylindrical resin original plate by laser machining; and fabricating a cylindrical die by the electroforming method using the resin original plate having the pattern formed.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATIONTOKYO 108-0075

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aso, Kosei Kanagawa, JP 8 83
Jozaki, Tomohide Kanagawa, JP 16 186
Murase, Hidehisa Kanagawa, JP 13 129
Okino, Setsuo Tokyo, JP 2 4
Sasaki, Yoshinari Tokyo, JP 27 289

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