IC CARD AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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N/A
Issued Date -
Mar 11, 2010
app pub date -
Nov 7, 2007
filing date -
Nov 7, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.
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