Wafer taping and detaping machine
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United States of America Patent
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N/A
Issued Date -
Mar 11, 2010
app pub date -
Sep 10, 2008
filing date -
Sep 10, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer taping and detaping machine implements a taping roller set and a detaping roller set to conduct an automatic taping and detaping process on a surface of a wafer that is positioned on a wafer mount so as to remove processing particles from the surface of the wafer.
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