Polishing Pad
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United States of America Patent
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Issued Date -
Mar 4, 2010
app pub date -
Dec 3, 2008
filing date -
Aug 29, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a polishing pad, and is more particularly related to a polishing pad, the width of groove bottom of polishing surface of which is 0 mm. The polishing pad includes a polishing surface on which comprises a plurality of grooves, wherein each groove includes a groove opening and a groove bottom, the characteristic of which being that the width of groove bottom of polishing surface is 0 mm. Therefore, when the polishing step is performed, it is not easy for polishing particles suspended in the slurry to deposit on the groove bottom and the deposits can be prevented from scratching the concerned work piece to avoid damage of work piece.
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