Resin Composition and Multi-Layer Structure Using the Same
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United States of America Patent
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Issued Date -
Mar 4, 2010
app pub date -
Apr 25, 2006
filing date -
Sep 28, 2004
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Abandoned
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Abstract
An object of the present invention is to provide a resin composition excellent in retort resistance at high temperature, gas barrier property, and anti-pinhole property as well as a multi-layer structure using the same. The invention relates to a resin composition comprising an ethylene-vinyl alcohol copolymer (A) and a polyamide-based resin (B), wherein the ethylene-vinyl alcohol copolymer (A) is an ethylene-vinyl alcohol copolymer comprising the following structural unit (1), preferably obtained by saponifying a copolymer of 3,4-diacetoxy-1-butene, a vinyl ester-based monomer, and ethylene:wherein X is a bonding chain which is an arbitrary bonding chain excluding an ether bond, R1 to R4 each independently represents an arbitrary substituent, and n represents 0 or 1.
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