Wafer level compliant packages for rear-face illuminated solid state image sensors
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United States of America Patent
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Issued Date -
Mar 4, 2010
app pub date -
Aug 26, 2009
filing date -
Feb 26, 2008
priority date (Note) -
Abandoned
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Abstract
A solid state image sensor includes a microelectronic element having a front face and a rear face remote from the front face, the rear face having a recess extending towards the front surface. A plurality of light sensing elements may be disposed adjacent to the front face so as to receive light through the part of the rear face within the recess. A solid state image sensor can include a microelectronic element, e.g., a semiconductor chip, having a front face and a rear face remote from the front face, a plurality of light sensing elements disposed adjacent to the front face, the light sensing elements being arranged to receive light through the rear face. A packaging structure, which can include a compliant layer, can be attached to a front surface of the microelectronic element. Electrically conductive package contacts may directly overlie the light sensing elements and the front face and be connected to chip contacts at the front face through openings in an insulating packaging layer overlying the front face.
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