Integrated Circuit Multilevel Inductor
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United States of America Patent
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Issued Date -
Mar 4, 2010
app pub date -
Sep 3, 2008
filing date -
Sep 3, 2008
priority date (Note) -
Abandoned
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Abstract
An integrated circuit (IC) multilevel inductor structure is provided. The IC multilayer inductor structure is made from an IC including a plurality of circuit layers, where the inductor is a three-dimensional (3D) loop formed over a plurality of the circuit layers. In a simple example, if the IC includes a first circuit layer and a second circuit layer, then the inductor 3D loop includes a first partial loop portion formed on the first circuit layer, a second partial loop portion formed on the second circuit layer, and a via connecting the first and second partial loop portions. More generally, the inductor typically includes a plurality of 3D loops. A first plurality of 3D loops is formed between the input and an nth circuit layer, and a second plurality of 3D loops is formed between the nth circuit layer and the output.
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