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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
GE GLOBAL SOURCING LLC	901 MAIN AVENUE NORWALK CT 06851

International Classification(s)

• F02B:INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENG....

• 2008 Application Filing Year
• F02B Class
• 770 Applications Filed
• 483 Patents Issued To-Date
• 62.73 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Yager, James Henry	North East, US	13	105
# of filed Patents : 13 Total Citations : 105

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Patent Citation Ranking

• 2 Citation Count
• F02B Class

• 5.09 % this patent is cited more than
• 13 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 27, 2012	US,8141359,B2   US8141359B2	GRANTED PATENT AS SECOND PUBLICATION
March 04, 2010	US,20100050631,A1   US20100050631A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 2015/0348,935

Method of Temporarily Attaching a Rigid Carrier to a Substrate

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Abstract

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Method for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid carrier with the sacrificial layer positioned therebetween. Electronic components and/or circuits may then be fabricated or other semiconductor processing steps employed (e.g., backgrinding) on the attached substrate. Once fabrication is completed, the substrate may be detached from the rigid carrier by heating the assembly to decompose the sacrificial layer.

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Description

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Claims

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