Resin composition of high thermal conductivity and high glass transition temperature (Tg) and for use with PCB, and prepreg and coating thereof
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United States of America Patent
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Issued Date -
Feb 25, 2010
app pub date -
Jan 6, 2009
filing date -
Aug 22, 2008
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Abandoned
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Abstract
A resin composition includes brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0-20 wt %, high thermal conductivity powder of 5-85 wt % and a processing aid of 0-10 wt %. The resin composition possesses high glass transition temperature, high thermal conductivity, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved.
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