Positive resist composition and method of forming resist pattern
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United States of America Patent
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Dec 25, 2012
Grant Date -
Feb 25, 2010
app pub date -
Aug 3, 2009
filing date -
Aug 4, 2008
priority date (Note) -
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Abstract
A positive resist composition including: a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid; and an acid-generator component (B) which generates acid upon exposure; dissolved in an organic solvent (S), the organic solvent (S) including an alcohol-based organic solvent having a boiling point of at least 150° C.; and a method of forming a resist pattern including: applying the positive resist composition on a substrate on which a first resist pattern is formed to form a second resist film; and subjecting the second resist film to selective exposure and alkali developing to form a resist pattern.
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