PHOTOLITHOGRAPHY APPARATUS WITH LEVELING ELEMENT AND METHOD FOR LEVELING A WAFER
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United States of America Patent
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Issued Date -
Feb 25, 2010
app pub date -
Aug 21, 2008
filing date -
Aug 21, 2008
priority date (Note) -
Abandoned
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Abstract
A method for leveling a wafer in a photolithography apparatus is disclosed, including inputting a wafer into the photolithography apparatus to be supported by a chuck, using at least three image capture devices to capture images of corresponding alignment marks on the wafer; and leveling the wafer according to the clarity of the images of the corresponding alignment marks on the wafer captured by the image capture device.
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