LED PACKAGE STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Feb 25, 2010
app pub date -
Jun 23, 2009
filing date -
Aug 21, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A LED package structure includes an insulating ceramic base, whereon a first surface and a second surface are formed. The LED package structure further includes a casing disposed on the first surface of the insulating ceramic base. A hole is formed on the casing. The LED package structure further includes a heat-dissipating structure connected to the second surface of the insulting ceramic base, at least one LED chip, and at least one conductive circuit disposed inside the casing. The conductive circuit includes a first conductive portion, and a second conductive portion connected to the first conductive portion via the hole and electrically connected to the LED chip.
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