METHOD OF BONDING A MICRIFLUIDIC DEVICE AND A MICROFLUIDIC DEVICE
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United States of America Patent
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Issued Date -
Feb 25, 2010
app pub date -
Nov 19, 2007
filing date -
Nov 21, 2006
priority date (Note) -
Abandoned
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Abstract
An aspect of the present invention includes a microfluidic assembly comprising: a planar substrate, a least a first surface of which has at least one open microchannel structure, a lid-forming sheet material attached with a first surface to said first surface of said planar substrate, said lid-forming sheet material is covering at least a portion of said at least one microchannel structure, wherein said lid-forming sheet material is attached to said planar substrate with a bonding material comprising particles to control the spacing between said substrate and said lid-forming sheet material. Other aspects of the present invention are reflected in the detailed description, figures and claims.
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