METHOD OF ANTISTATIC DEPOSITION ON COMPONENTS OF MOBILE PHONE
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United States of America Patent
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N/A
Issued Date -
Feb 18, 2010
app pub date -
Aug 31, 2007
filing date -
Sep 1, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides an antistatic deposition method of a wireless terminal component, which comprises depositing tin (Sn) or a tin-aluminum (Sn—Al) alloy on a molded material for a wireless terminal component. Also, the present invention discloses an antistatic deposition method of a wireless terminal component, which comprises: depositing tin (Sn) or a tin-aluminum (Sn—Al) alloy on a molded material for a wireless terminal component; and depositing one or more materials selected from the group consisting of Si, SiO, Ti, TiO, Al O and a mixture thereof on the deposited tin (Sn) layer or the deposited tin-aluminum (Sn—Al) alloy layer. The antistatic deposition method of a wireless terminal component according to the present invention has advantageous effects in that it overcomes the problems of the prior art that generation of static electricity adversely affects the performance of the inner circuits of the wireless terminal in case where a metal such as nickel (Ni), chrome (Cr) or the like is deposited on a wireless terminal component so as to create a mirror effect, and in that it can maintain an mirror effect and the performance of radio frequencies, can prevent peel-off of a tin (Sn) or tin-aluminum (Sn—Al) alloy deposited on a molded material for a wireless terminal component, and can improve scratch resistance and impact resistance of the wireless terminal component.
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Patent Citation Ranking
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- 4.47 % this patent is cited more than
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