METHOD OF PLATING A WAFER
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United States of America Patent
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Issued Date -
Feb 18, 2010
app pub date -
Aug 12, 2008
filing date -
Aug 12, 2008
priority date (Note) -
Abandoned
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Abstract
A plating method for forming a uniform magnetic film in conducting a plating treatment on a wafer with a magnetic film of, for instance, a Fe—Co-based alloy. Specifically, the method comprises the steps of supplying a plating solution through a plating-solution-supply section of a plating tank to a wafer, which placed on an opening of the plating tank, and conducting a plating treatment on the wafer while the plating solution is kept in contact with a plating target surface of the wafer, wherein the plating solution employed is one forming a magnetic film, and the plating treatment is done while a magnetic field is applied to the plating solution in contact with the plating target surface of the wafer.
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