Powder-Fiber Adhesive
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United States of America Patent
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N/A
Issued Date -
Feb 18, 2010
app pub date -
Jun 13, 2006
filing date -
Jun 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An adhesive is provided, in particular for the adhesion of conductive materials, having at least one binder component and fillers, wherein the fillers contain fibers or a fiber-powder mixture and the fibers and/or powder contain an electrically conductive material. Further, an assembly is provided made of a sputtering target material and a carrier material with an adhesive.
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