METHOD FOR FILLING THROUGH HOLE OR NON-THROUGH HOLE FORMED ON BOARD WITH FILLER

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United States of America Patent

APP PUB NO 20100031501A1
SERIAL NO

12188790

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Abstract

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A method for filling a through hole or a non-through hole formed on a board with a fluent filler comprises combining at least one filling method selected from a centrifugal filling method and a magnetic filling method with an ultrasonic filling method.

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Patent Owner(s)

Patent OwnerAddress
NAPRA CO LTD8-15-17-204 OKUDO KATSUSHIKA-KU TOKYO 124-0022

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuwana, Yoshiharu Katsushika-Ku, JP 12 148
Sekine, Shigenobu Katsushika-Ku, JP 59 394
Sekine, Yurina Katsushika-Ku, JP 38 353

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