Method and apparatus for bonding a sheet for a corrugated cardboard box

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100029454A1
SERIAL NO

12457975

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A bonding apparatus according to the present invention relates to a sewing machine (28) which on stitching a connecting flap and a flap to be connected (hereafter referred to as only `connected flap`) of one unit, one set of two sheets for a corrugated cardboard box, ensures the folding of the connecting flap and the connected flap, inhibits the blind movement of the position, rectangular in section, of the sheets for the corrugated cardboard box when thread-stitching them, solves the load burdened on a looper mechanism, and provides an appropriate thread-stitching work. The sewing machine (28) comprises a sewing-machine needle mechanism (28b) provided with a sewing-machine needle (28a) and the looper mechanism (28d) having a needle plate (28c). This sewing machine (28) arranges the needle plate (28c) of the looper mechanism (28d) inside the connecting flap (12a) and the sewing-machine needle mechanism (28b) outside the connected flap (12b) and holds the position, rectangular in section, of the both sheets (W1. W2) of the corrugated cardboard box and intermittently moves them in parallel to the first folding line (10) and synchronizes the sewing-machine needle (28a) with the intermittent movement to reciprocally move it horizontally from the outside to the inside of the threading portion (S) so as to stitch the threading portion with threads.

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Patent Owner(s)

Patent OwnerAddress
MORIMOTO MFG CO LTD180 SUNA OHAZA SHIJONAWATE-SHI OSAKA-FU
TAWADA CO LTDAICHI

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hosokawa, Makoto Osaka, JP 21 193
Kuragake, Kenji Osaka, JP 1 0
Matsuzaki, Hiroshi Osaka, JP 65 1419
Morimoto, Kunihiko Osaka, JP 1 0
Tawada, Taichi Aichi, JP 1 0
Yamaura, Hiroshi Osaka, JP 26 189

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