METHOD OF FABRICATING PRINTED CIRCUIT BOARD HAVING SEMICONDUCTOR COMPONENTS EMBEDDED THEREIN
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United States of America Patent
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N/A
Issued Date -
Feb 4, 2010
app pub date -
Jul 28, 2009
filing date -
Jul 31, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for fabricating a printed circuit board having semiconductor components embedded therein is provided. A carrier board having at least a predetermined hole area is provided. A plurality of through holes are formed in the surround of the predetermined hole area on the carrier board. A rectangular cavity is formed by punching to remove the predetermined hole area, and a plurality of through holes are formed around the rectangular cavity The through holes facilitate receipt of the semiconductor chip and filling of a fixing material in the rectangular cavity, to avoid displacement of the semiconductor chip in subsequent fabricating steps that would otherwise cause a drawback, that is, a wiring to be formed later is improperly electrically connected to the semiconductor chip.
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