METHOD OF FORMING ELECTRICAL TRACES ON SUBSTRATE

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United States of America Patent

APP PUB NO 20100021653A1
SERIAL NO

12330577

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Abstract

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An exemplary method for forming electrical traces on a substrate includes flowing steps. Firstly, a circuit pattern is formed on the substrate by printing a silver ions-containing ink. The ink comprises an aqueous carrier medium, and a silver halide emulsion soluble in the aqueous carrier medium. Secondly, an irradiation ray irradiates the circuit pattern to reduce the silver ions into silver to form a silver particle circuit pattern comprised of silver particles. Thirdly, a metal overcoat layer is electroless-plated on the silver particle circuit pattern thereby obtaining electrical traces.

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Patent Owner(s)

Patent OwnerAddress
ZHEN DING TECHNOLOGY CO LTDNO 6 LANE 28 SAN HO RD SAN SHI VILLAGE TAYUAN TAOYUAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BAI, YAO-WEN Shenzhen City, CN 19 61
LIN, CHENG-HSIEN Tayuan, TW 81 296
ZHANG, QIU-YUE Shenzhen City, CN 6 10
ZHANG, RUI Shenzhen City, CN 806 5113

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