Method of manufacturing composite copper material

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United States of America Patent

SERIAL NO

12387608

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Abstract

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An element such as Cr is caused to dissolve sufficiently in a base-material metal (Cu) in a solid solution state at a high temperature and a material in a supersaturated condition is obtained by performing quenching. After that, a strain is applied to this material and this material is subjected to aging treatment at a low temperature simultaneously with or after the application of this strain. As a result of this, it is possible to obtain a copper alloy having properties desirable as an electrode material, for example, a hardness of not less than 30 HRB, an electrical conductivity of not less than 85 IACS %, and a thermal conductivity of not less than 350 W/(m·K).

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Patent Owner(s)

Patent OwnerAddress
HONDA GIKEN KOGYO KABUSHIKI KAISHA1-1 MINAMI-AOYAMA 2-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baba, Hiroki Sayama-shi, JP 6 33
Funaki, Mitsuhiro Sayama-shi, JP 6 31
Horimukai, Toshiyuki Sayama-shi, JP 10 27
Ohyama, Shinya Sayama-shi, JP 3 7

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