INTEGRATED MICROWAVE CIRCUIT
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United States of America Patent
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N/A
Issued Date -
Jan 28, 2010
app pub date -
Jul 8, 2009
filing date -
Jul 15, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An hermetically sealed integrated microwave circuit comprising a coplanar waveguide on a printed circuit board (PCB) electrically connected on one major surface to an integrated circuit, and thermally and electrically connected to a ball grid array (BGA) on its opposite major surface, in which the PCB has at least first and second printed layers, a microwave signal path extends from a ball of the BGA through a through-hole in both printed layers to the coplanar wave guide, and plural ground paths extend from balls of the BGA through first through-holes in the first printed layer of the PCB and through second through-holes of the second printed layer of the PCB, the first and second through-holes being non-coincident, to allow for an hermetic seal across the PCB whilst introducing a predetermined impedance in the PCB between the signal and ground paths.
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