REUSABLE MANDREL FOR SOLID FREE FORM FABRICATION PROCESS
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United States of America Patent
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Issued Date -
Jan 28, 2010
app pub date -
Jul 15, 2009
filing date -
Jul 23, 2008
priority date (Note) -
Abandoned
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Abstract
The present invention provides a reusable mandrel and method of using the mandrel in a SFFF process. A thermally conductive feature is located on the surface of the mandrel. The mandrel does not bond to the deposited part so that it may be easily removed without damaging either the mandrel or the deposited part. The present invention further enables the manufacture of components where the deposition surface is produced to precision, net shape geometries.
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