METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Jan 28, 2010
app pub date -
Jan 15, 2009
filing date -
Jul 28, 2008
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing a flexible printed circuit sheet (FPCB), comprising: providing a flexible copper clad laminate (FCCL), the FCCL comprising an insulating layer and a copper layer disposed thereon; providing a reinforcing sheet, the reinforcing sheet comprising a base and a binder layer attached thereon; attaching the FCCL onto the binder layer of the reinforcing sheet with the copper layer exposed; forming electrical traces in the copper layer, thus obtaining a FPCB substrate; and removing the FPCB substrate from the reinforcing sheet.
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