Chemical mechanical polishing pad having electrospun polishing layer
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United States of America Patent
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Issued Date -
Jan 21, 2010
app pub date -
Jul 15, 2008
filing date -
Jul 15, 2008
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Abandoned
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Abstract
Chemical mechanical polishing pads having an electrospun polishing layer are provided, wherein the electrospun polishing layer has a polishing surface that is adapted for polishing a semiconductor substrate. Also provided are methods of making such chemical mechanical polishing pads and for using them to polish semiconductor substrates.
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