METHOD AND DEVICE FOR ADJUSTING THE DEPOSIT POSITION OF A SEMICONDUCTOR WAFER IN AN OVEN
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United States of America Patent
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Issued Date -
Jan 21, 2010
app pub date -
Jul 16, 2009
filing date -
Jul 17, 2008
priority date (Note) -
Abandoned
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Abstract
A method for loading a semiconductor wafer into a process unit comprises opening the process unit, inserting a wafer into the process unit, adjusting the position of the wafer in the process unit so that it is in a certain position in relation to markers, and inserting a camera into the process unit facing the markers. The camera acquires an image of the markers and of a part of the wafer, and displays on a display screen the image acquired. The position of the wafer is adjusted according to the position of the wafer in relation to the markers on the image displayed.
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