Wafer Scanning
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United States of America Patent
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Issued Date -
Jan 21, 2010
app pub date -
Jun 2, 2006
filing date -
Jun 3, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor wafer measuring device including a wafer mover adapted to move a semiconductor wafer; a measurement head adapted to scan a surface of the semiconductor wafer as the semiconductor wafer is moved by the wafer mover; and a controller. The controller is adapted to control movement of the wafer mover to provide a first scanning segment of a first portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the first scanning segment, a second scanning segment of a second different portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the second scanning segment; and rotating the semiconductor wafer between the first and second scanning segments.
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