METHOD OF FORMING LIGHT EMITTER AND MOLDING DIE

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United States of America Patent

APP PUB NO 20100006215A1
SERIAL NO

12438335

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The manufacturing efficiency of a light emitter (product) having a lens member and a light emitting device is efficiently improved. With a molding die for forming a light emitter, a frame before the molding and bonding process, with a required number of light-emitting devices mounted thereon, is set on a setting section provided in an upper die. A required amount of transparent liquid resin material is supplied by a dispenser into each of cavities of cavity blocks provided in a lower die in correspondence to the light-emitting devices, respectively. A molding die is closed so as to elastically press the mouths of the cavities onto the light emission surfaces of the light emitting devices, respectively. Thus, the resin in each cavity is compression-molded into the lens member formed in accordance with the shape of the cavity, and simultaneously, the lens members are bonded to the light emission surfaces of the light emitting devices to obtain a light emitter emitter and accordingly a frame after the molding and bonding process.

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Patent Owner(s)

Patent OwnerAddress
TOWA CORPORATIONKYOTO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawakubo, Kazuki Otsu-shi, JP 11 75
Takase, Shinji Uji-shi, JP 22 182

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