Low Profile and High Efficiency Light Device for Backlighting Applications

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United States of America Patent

SERIAL NO

12560534

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A light source having a flexible substrate and a plurality of dies having LEDs is disclosed. The light source can be conveniently utilized to provide an extended light source by bonding the light source to a suitable light pipe. The substrate is divided into first and second regions. The dies are bonded to the substrate in a first region. A portion of the surface of the substrate in the second region is reflective. The substrate is bent such that the second region forms a reflector that reflects light that would otherwise be emitted in a non-useful direction to a more useful direction. The substrate can be constructed from a three layer flexible circuit carrier in which the dies are mounted on a bottom metal layer to provide an improved thermal path for heat generated in the dies.

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Patent Owner(s)

Patent OwnerAddress
AVAGO TECHNOLOGIES ECBU (SINGAPORE) PTE LTDFORT COLLINS CO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chew, Tong Fatt Penang, MY 30 756
Pang, Siew It Penang, MY 32 893

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