SOLDER CONTACT

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United States of America Patent

APP PUB NO 20100001400A1
SERIAL NO

12496958

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Abstract

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A low melting temperature solder is provided for producing a solder contact between a connection element and a contact structure of a semiconductor component.

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Patent Owner(s)

Patent OwnerAddress
DEUTSCHE CELL GMBHBERTHELSDORFER STR 111A FREIBERG 09599

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bitnar, Bernd Freiberg, DE 24 77
Krause, Andreas Dresden, DE 129 810
Schmidt, Hartmut Munchen, DE 45 230

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