SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF
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United States of America Patent
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Issued Date -
Jan 7, 2010
app pub date -
Jul 7, 2008
filing date -
Jul 7, 2008
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Abandoned
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Abstract
A semiconductor device and a fabrication method thereof are provides. The semiconductor device comprises a semiconductor substrate having a cavity and a light-emitting diode chip disposed in the cavity. The cavity is filled with an encapsulating resin to cover the light-emitting diode chip. Two isolated metal lines are disposed on the encapsulating resin and electrically connected to the light-emitting diode chip. At least two isolated inner wiring layers are disposed in the cavity and electrically connected to the isolated metal lines. At least two isolated outer wiring layers are disposed on a bottom surface of the semiconductor substrate and electrically connected to the isolated inner wiring layers.
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