COPPER-CLAD LAMINATE, PRINTED-WIRING BOARDS, MULTILAYER PRINTED-WIRING BOARDS, AND METHOD FOR MANUFACTURING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 7, 2010
app pub date -
Sep 21, 2006
filing date -
Sep 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention is to significantly improve copper-foil adhesion strength (copper-foil peel strength) without roughening or blackening a copper-foil surface, and thereby to provide a copper-clad laminate used favorably in a high frequency range. The copper-clad laminate (101) for a single-sided printed-wiring board is formed by bonding a copper foil (4) onto a surface of an insulating substrate (2) with an LCP/PFA composite film (3) disposed in between. The insulating substrate (2) is made of a fluororesin prepreg 2A. The copper foil (4) is a rolled copper foil, the both surfaces of which are smooth and not roughened or blackened. The insulating substrate (2) and the copper foil (4) are bonded to each other with the composite film (3) disposed in between by firing and pressing them under temperature conditions which are 5.degree. C. to 40.degree. C. higher than the melting point of PFA and lower than the melting point of LCP.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully