METALLIC PASTES AND INKS
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United States of America Patent
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N/A
Issued Date -
Jan 7, 2010
app pub date -
Jul 1, 2009
filing date -
Jul 2, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Ω·cm or less. Electrical components of an assembly can be interconnected by a metallic conductor formed by curing the metallic composition on a substrate. A metallic composition including metal nanoparticles can be deposited on a substrate and solidified. The metallic composition can be contacted with a metal wire before or after solidification of the metallic composition and secured to the solidified metallic composition.
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